| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which can prevent projection of a through conductor, arranged in the through hole of an insulating plate consisting of a ceramic sintered body, from the main surface of the insulating plate. <P>SOLUTION: The wiring board comprises an insulating plate 1 consisting of a ceramic sintered body and having a through hole 2 penetrating in the thickness direction, and a through conductor 3 arranged in the through hole 2 and having a side surface bonded to the inner side surface of the through hole 2. An annular air gap 4 is formed along the side surface of the through conductor 3, in plan view, between the inner side surface of the through hole 2 and the side surface of the through conductor 3. Since thermal expansion of the through conductor 3 can be absorbed by the air gap 4, projection of the through conductor 3 from the insulating plate 1 can be prevented by preventing expansion of the through conductor 3 in the length direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
