| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly productive semiconductor chip testing apparatus capable of accurately and automatically accomplishing contact alignment of a semiconductor chip and a probe. <P>SOLUTION: A semiconductor chip testing apparatus comprises a probe unit 1 having six drive shafts, a probe 15 fitted to the tip of the probe unit 1, a chip fixing base 2 that attracts and fixes a semiconductor chip 17 whose electric characteristics are to be tested, a table 25 that feeds the probe 15 fitted with the chip fixing base 2 to a prescribed measuring position, a chip sensor 3 that detects the position of the semiconductor chip 17, a probe sensor 4 that detects the position of the probe 15, a measuring instrument 5 that measures the angle of inclination of the probe 15 relative to the chip fixing base 2 and the height of the chip fixing base 2, and a control device that controls the six drive shafts of the probe unit 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
