发明名称 |
BUMP STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE |
摘要 |
Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump.
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申请公布号 |
US2012119359(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201113240302 |
申请日期 |
2011.09.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
IM YUN-HYEOK;KIM JONG-YEON;CHO TAE-JE;KANG UN-BYOUNG |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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