SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

Disclosed are a semiconductor package and a method of manufacturing the same. The semiconductor package comprises a package cap which is capable of radiating high temperatures and performs a shield function preventing transmission of electromagnetic waves into and/or out of the semiconductor package. The semiconductor package including the package cap prevents chip malfunctions and improves device reliability. The package cap is positioned to cover first and second semiconductor chips of a semiconductor package.