| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting method capable of ensuring stable pick-up action, even if an electronic component or a carrier tape has a dimensional error due to different manufacturing lots. <P>SOLUTION: A tape splicing method which joins an already-installed carrier tape 15 and a newly-installed carrier tape 15A in a tape feeder is adopted to electronic component mounting. If a joint portion J of the already-installed carrier tape 15 and the newly-installed carrier tape 15A is detected by an optical sensor 30, component suction height measurement is executed on a component P stored in the carrier tape 15A by a height measuring instrument 12, concerning the tape feeder in which the joint portion J is detected. On the basis of the measurement result, component suction height data indicating a target lowering height to which a suction nozzle 10a is lowered is updated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
