| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for preventing generation of failures caused by deformation of a heat radiation plate. <P>SOLUTION: A semiconductor device 10 has: a substrate; a semiconductor chip mounted on the substrate; a sealing body 13 sealing the semiconductor chip on the substrate; and a plurality of heat radiation plates 14 buried in the sealing body 13 at intervals so that the respective one surfaces are exposed to exterior and located on the same plane. In addition, a method of manufacturing the semiconductor device 10 includes the following steps of: arranging the substrate and the plurality of heat radiation plates 14 in a mold so as to be opposed to each other; and injecting a melted sealing resin into between those to seal the chip onto the substrate and integrate the plurality of heat radiation plates 14 with the sealing resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
