发明名称 GRINDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a grinding apparatus that can stop grinding before a sapphire substrate or the like is damaged. <P>SOLUTION: The grinding apparatus includes a chuck table for holding a workpiece and a grinding means where a grinding wheel provided with a grinding stone for grinding a workpiece held by the chuck table is attached rotatably. The grinding means includes: a spindle housing for rotatably supporting a spindle to which the grinding wheel is connected; a vibration measuring means mounted to the spindle housing; a grinding feed means that supports the spindle housing and moves it in a direction of approaching and separating to/from the chuck table; a receiving section for receiving vibration information output from the vibration measuring means; an failure recording section where abnormal vibration information is recorded beforehand; and a control section that detects abnormalities in vibration information received by the receiving section on the basis of the vibration information received by the receiving section and abnormal vibration information registered in the failure recording section and controls the grinding means. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012091245(A) 申请公布日期 2012.05.17
申请号 JP20100238465 申请日期 2010.10.25
申请人 DISCO CORP 发明人 URAYAMA TAKAYO
分类号 B24B49/10;B24B7/22;B24B55/00;H01L21/304 主分类号 B24B49/10
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