| 摘要 |
<P>PROBLEM TO BE SOLVED: To inhibit an amount that an evaporation material deposits in a vacuum device, and to shorten a time for cleaning an inside of the vacuum device. <P>SOLUTION: In a vacuum deposition device in which an element substrate is arranged on a vapor deposition mask, and evaporation sources 41, 42 are arranged at a lower part of the vapor deposition mask, a sheet shutter 60 is arranged to cover the evaporation source 41, 42, and vacuum deposition is carried out to the element substrate through an opening 61 of the sheet shutter 60. When not vapor-depositing to the element substrate, the sheet shutter 60 covers openings of the evaporation source 41, 42. Therefore, an evaporation substance from the evaporation source 41, 42 is mainly deposited on the sheet shutter 60. The sheet shutter 60 can be wound to a winding mechanism 62, when an evaporation material accumulates on the sheet shutter 60 more than a predetermined amount, the sheet shutter 60 is interchanged. By this, exchange of the sheet shutter 60 can be performed for a short time, and an amount that an evaporation material deposits in the vacuum device can be inhibited. <P>COPYRIGHT: (C)2012,JPO&INPIT |
