发明名称 LED PACKAGE MANUFACTURING SYSTEM AND RESIN COATING METHOD IN LED PACKAGE MANUFACTURING SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin coating device and a resin coating method capable of improving a production yield in an LED package manufacturing system by uniformizing light-emission characteristics of LED packages even when there is variation in emission wavelengths of individual LED elements. <P>SOLUTION: In resin coating used for manufacturing an LED package which is formed by coating an LED element with a phosphor-containing resin: a light transmission member 43 which is test coated with a resin 8 for measuring light-emission characteristics is mounted on a light transmission member mounting section 41 having a light source section; a deviation between a measurement result by a light-emission characteristics measurement section 39 and a predetermined light-emission characteristics is obtained, the measurement result being obtained by measuring light-emission characteristics of light emitted from the resin 8 by irradiating the resin 8 coated on the light transmission member 43 with exciting light emitted from the light source section; and an appropriate resin coating amount that should be coated on an LED element in actual production is derived based on the deviation. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012094675(A) 申请公布日期 2012.05.17
申请号 JP20100240468 申请日期 2010.10.27
申请人 PANASONIC CORP 发明人 NONOMURA MASARU
分类号 H01L33/52;B05C11/10;H01L21/56 主分类号 H01L33/52
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