| 发明名称 |
FOAMABLE COMPOSITION, FOAMABLE MOLDED BODY, AND FOAM |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a foamable composition capable of providing a foam having a high conductivity; a foamable molded body obtained by molding the foamable composition; and a foam obtained by foaming the foamable composition or the foamable molded body. <P>SOLUTION: The foamable composition contains a low-melting point metal and an foamable resin particle. The foam composed of the low-melting point metal is obtained by foaming the foamable molded body obtained by molding the foamable composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012092228(A) |
申请公布日期 |
2012.05.17 |
| 申请号 |
JP20100240936 |
申请日期 |
2010.10.27 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
HAYASHI YOHEI;UI TAKEHIRO;MITSUOKA YOSHIAKI |
| 分类号 |
C08J9/12 |
主分类号 |
C08J9/12 |
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