| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition exhibiting good adhesivity to an Ni-Pd leadframe and low in the elastic modulus, and to provide a semiconductor device excellent in reliability such as solder cracking resistance by using the same as a die attach material for a semiconductor. <P>SOLUTION: The resin composition for adhesion of a semiconductor element contains, as essential components: (A) a silver powder; (B) a compound having a glycidyl group; and (C) an imidazole compound having a melting point of ≥180°C, wherein a part of the (B) compound is a compound having a polyalkylene oxide skeleton and a glycidyloxyphenyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
