Plating method of substrate and manufacturing method of circuit board using the same

摘要

A method of plating a substrate and a method of manufacturing a circuit board using the method of plating a substrate. The method of manufacturing a circuit board may include: providing a panel substrate, the panel substrate divided into a circuit board area and a dummy area; calculating a ratio of an area of a circuit pattern to be formed by plating in the circuit board area; determining a ratio of an area being plated in the dummy area by considering the ratio of the area being plated in the circuit board area; setting a plating part in the circuit board area and the dummy area; and forming the circuit pattern by electroplating the panel substrate. Accordingly, deviation in thickness of plating between circuit patterns can be improved.