发明名称 |
FLIP CHIP BONDING APPARATUS AND MANUFACTURING METHOD THEREOF |
摘要 |
According to example embodiments, a flip chip bonding apparatus includes a metal chamber, a stage in the metal chamber, and a planar antenna in the chamber. The stage may be configured to receive a circuit board having flip chips arranged thereon. The antenna may be configured to bond the flip chips to the circuit board by inductively heating the flip chips on the circuit board. |
申请公布号 |
US2012118876(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201113289525 |
申请日期 |
2011.11.04 |
申请人 |
CHO JUNG HYUN;TOLMACHEV YURY;JEON SANG JEAN;LEE BYUNG JOON;SHIN JAE BONG;KIM HYUNGJOON;KIM MOON SEOK;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO JUNG HYUN;TOLMACHEV YURY;JEON SANG JEAN;LEE BYUNG JOON;SHIN JAE BONG;KIM HYUNGJOON;KIM MOON SEOK |
分类号 |
H05B6/10 |
主分类号 |
H05B6/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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