| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure that extremely eliminates the degradation of a light emitting diode (LED) chip connection adhesive agent in the light-emitting of a blue LED chip, reduces void between a connected chip and a substrate, and eliminates junction failure caused by rupture of the void at the time of use, by solving the lack of exhaust heat and the problem of heat resistance property by wire bonding. <P>SOLUTION: The connection structure includes a LED chip, a bump, a substrate electrode, and an adhesive agent for flip, and the adhesive agent for flip includes polyimide resin or polyamide resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
