| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure in which an object is provided on one side of an aluminum base plate and a radiator is provided on the other side, and in the case of soldering the object or the radiator to the base plate, the surface layer side of the base plate is formed by an optimum plated layer to further improve wettability of solder. <P>SOLUTION: In the heat dissipation structure, the object is provided by sticking it fast onto one side of the aluminum base plate 2, the radiator 3 is provided on the other side, the surface layer side of the base plate 2 is formed by the plated layer for improving wettability of solder H, one or both of the object and the radiator 3 are soldered to the base plate 2, heat of the object is conducted to the radiator 3 through the base plate 2, and the object is thereby cooled. The plated layer is made to contain at least nickel and tin, nickel accounts for 0.18-0.48% by weight ratio of the total base plate 2, and tin accounts for 0.10-0.38% by weight ratio of the total base plate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
