ADHESIVE COMPOSITION, ADHESIVE SHEET, MATERIAL FOR PROTECTING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor apparatus excellent in adhesivity in pressure bonding, and excellent in connection reliability and insulation reliability when being cured; and to provide an adhesive sheet using the same.

SOLUTION: The adhesive composition 12 contains (A) a silicone resin constituted of a repeating unit represented by formula (1), (B) a thermosetting resin, and (C) a compound having a flux activity. In the formula, R1to R4are a 1-8C monovalent hydrocarbon group; l and m are an integer of 1 to 100; and X and Y are a divalent organic group.

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