| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board in which manufacturing process can be simplified. <P>SOLUTION: The method of manufacturing a multilayer wiring board includes a preparation step for preparing a sheet-like core insulation material 13 having a thickness of 100 μm or less, and a boring step for forming a through hole 16 opening to the main surface 14 and the rear surface 15 of the core by performing laser boring for the core insulation material 13. In a conductor formation step, electrolytic copper plating is performed following to electroless copper plating and a through hole conductor 17 is formed by filling the through hole 16 of the core insulation material 13 entirely, and a conductor layer 19 is formed on the main surface 14 and the rear surface 15 of the core of the core insulation material 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
