发明名称 |
FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when a chip is picked up. This film for semiconductor is characterized in that in the case where peel strength at 23°C of the chip is defined as "F 23 (cN/25mm)" and peel strength at 60°C of the chip is defined as "F 60 (cN/25mm) ", F 23 is in the range of 10 to 80 and F 60 /F 23 is in the range of 0.3 to 5.5. This makes it possible to improve a pickup property of the chip, to thereby prevent generation of defects in a semiconductor element. |
申请公布号 |
EP2453469(A1) |
申请公布日期 |
2012.05.16 |
申请号 |
EP20100796970 |
申请日期 |
2010.05.31 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
YASUDA HIROYUKI;HIRANO TAKASHI |
分类号 |
H01L21/301;C09J7/02;C09J133/00;C09J161/06;C09J163/00;H01L21/52 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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