发明名称 Apparatus for processing wafers
摘要 <p>An apparatus for processing wafers one at a time. The apparatus has a vacuum chamber 1 into which wafers are loaded through a pair of loadlocks 3, 4 which are spaced one above the other. A robot within the vacuum chamber 1 has a pair of gripper arms 22, 29 which are moveable along and rotatable about a vertical axis 23 so as to be moveable between the loadlocks 3, 4 and a wafer processing position. Each of the loadlocks 3, 4 has a vertically moveable portion 8, 26 which is moveable away from the remainder of the loadlock to provide access in a horizontal plane for one of the gripper arms 22, 29.</p>
申请公布号 EP1833079(B1) 申请公布日期 2012.05.16
申请号 EP20070012911 申请日期 2000.04.17
申请人 APPLIED MATERIALS, INC. 发明人 MITCHELL, ROBERT J.C.S.;RELLEEN, KEITH D.;RUFFELL, JOHN
分类号 H01L21/677;B65G49/07;H01J37/317;H01L21/00;H01L21/265;H01L21/67;H01L21/687 主分类号 H01L21/677
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