LEAD FRAME AND SEMICONDUCTOR DEVICE PACKAGE USING THE SAME

摘要

PURPOSE: A lead frame and a semiconductor package using the same are provided to minimize the decrease of luminous intensity as times pass by since at least one part from the side of an extrudate serving as a reflecting surface is replaced with a metal coating surface. CONSTITUTION: A first lead frame body(111) is formed into a flat plate shape. A second lead frame body(112) is arranged to face the first lead frame body. An inner plating reflecting surface(113) is formed one or more inner side of first to fourth bending leads. A test terminal(114) is formed to be projected to outside from a middle portion around a vertical direction of the first and second bending leads. The first and second lead frame bodies includes one or more molding holes(115).