摘要 |
PURPOSE: A coil type heating element, a method for manufacturing the same, and a semiconductor heat treatment chamber including the same are provided to uniformly maintain a temperature distribution in the chamber by regulating the wiring number of the coil type heating element. CONSTITUTION: Both ends of a heating element(10) is formed toward an identical direction. The heating element includes a coil part(12). First and second non-heating elements(20, 30) are expanded from both the ends of the heating element. Aluminum coated terminal parts(21, 31) are formed on the end parts of the first and the second non-heating elements.
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