发明名称 Light emitting device package and method of manufacturing the same
摘要 A light emitting device package includes: first (11,21,31,41,51,61) and second (12,22,32,42,52,62) electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device (13,23,43,53,63) disposed on an upper surface of at least one of the first and second electrodes; a reflection wall (15,25,35,45,55,65) disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film (16,26,36,46,56,66) disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.
申请公布号 EP2453488(A2) 申请公布日期 2012.05.16
申请号 EP20110188523 申请日期 2011.11.10
申请人 SAMSUNG LED CO., LTD. 发明人 PARK, NA NA;PARK, IL WOO;KWAK, CHANG HOON
分类号 H01L33/48;H01L33/50;H01L33/60;H01L33/62 主分类号 H01L33/48
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