发明名称 MANUFACTURING METHOD OF LIGHT EMITTING DEVICE PACKAGE AND FRAME FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE
摘要 PURPOSE: A method for manufacturing a light emitting device package and a frame for manufacturing a light emitting device package are provided to preventing a package body from being separated from a lead portion during processing by combining the package body with a stepped structure of a supporting portion. CONSTITUTION: A base frame including a base portion(101), a pair of lead portions, and one or more supporting portions(103) is prepared. A package body(104) is formed to be combined with the stepped structure of the supporting portion. The lead portion is separated from the base portion. A light emitting device(105) is arranged on one or more lead portions. The package body is separated from the supporting portion.
申请公布号 KR20120048995(A) 申请公布日期 2012.05.16
申请号 KR20100110529 申请日期 2010.11.08
申请人 SAMSUNG LED CO., LTD. 发明人 KWON, CHOONG HWAN
分类号 H01L33/62 主分类号 H01L33/62
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