摘要 |
PURPOSE: A method for manufacturing a light emitting device package and a frame for manufacturing a light emitting device package are provided to preventing a package body from being separated from a lead portion during processing by combining the package body with a stepped structure of a supporting portion. CONSTITUTION: A base frame including a base portion(101), a pair of lead portions, and one or more supporting portions(103) is prepared. A package body(104) is formed to be combined with the stepped structure of the supporting portion. The lead portion is separated from the base portion. A light emitting device(105) is arranged on one or more lead portions. The package body is separated from the supporting portion. |