QUAD FLAT PACKAGE WITH EXPOSED PADDLE

摘要

PURPOSE: A quad flat package with an exposed paddle is provided to allow wave soldering since fused solder is penetrated to a pedal end portion by arranging the pedal end portion at the corner area of a lower portion of a molding portion. CONSTITUTION: A pedal(110) supports a semiconductor chip(120). The pedal comprises a pedal central portion(111), first to fourth pedal end portions(112a-112d), and first to fourth pedal connection portions(113a-113d). A molding portion(140) protects the semiconductor chip from an external environment. A plurality of leads(150) is formed at the sides of the molding portion. A plurality of bonding wires electrically connects the plurality of leads to the semiconductor chip.