| 摘要 |
Disclosed is a method for producing a formed circuit component, wherein the surface of a substrate is roughened by being irradiated with laser ray instead of being etched using a chemical agent, thereby assuring sufficient adhesive strength with an electroless plating. Specifically disclosed is a method for producing a formed circuit component, which comprises: a first step of forming a substrate (1); a second step of radiating a first laser ray (2) and thereby roughening either a surface of the substrate (1) or only a circuit forming region (1a) of the substrate surface; a third step of applying a catalyst (3) to the surface of the substrate (1); a fourth step of drying the substrate (1); a fifth step of radiating a second laser ray (4), thereby lowering or eliminating the function of the catalyst (3) on a non-circuit forming region (1b); and a sixth step of electroless-plating the circuit forming region (1a) of the substrate surface. |
