| 摘要 |
The invention provides an electronic component assembly method and device, and heat influence during assembly is reduced, and the electronic component is assembled via a column projection in high efficiency. A substrate is heated to be in a temperature higher than normal temperature while a metal column projection is formed on the substrate via a column projection forming device, after the column projection is formed, the state that the temperature of the substrate does not reduce to normal temperature is maintained, and an electronic component sheet is disposed on the column projection of the substrate via a chip jointing machine to perform ultrasonic wave jointing. |
