发明名称 Copper microparticle and process for producing the same
摘要 <p>Copper microparticles that are fine and contain substantially none of agglomerated particles. For example, there are provided copper microparticles of 0.005 to 2.0 µm average particle diameter (D) as measured by an electron microscope, 0.005 to 2.0 µm average particle diameter (d) as measured by a dynamic light scattering particle size distribution measuring apparatus and 0.7 to 2 d/D ratio. There is provided a process comprising mixing a divalent copper oxide with a reducing agent in the presence of a complexing agent and a protective colloid in a liquid medium to thereby produce copper microparticles without formation of a univalent copper oxide from the divalent copper oxide. Further, there is provided a process comprising reducing a divalent copper oxide in the presence of a complexing agent and a protective colloid, such as a protein, to thereby form metallic copper microparticles, adding a protective colloid scavenger, such as a protease, to thereby remove the protective colloid and effect agglomeration of metallic copper microparticles, and filtering the mixture by means of a pressure filter, a vacuum filter, a suction filter, etc.</p>
申请公布号 EP2452767(A1) 申请公布日期 2012.05.16
申请号 EP20120154583 申请日期 2005.08.18
申请人 ISHIHARA SANGYO KAISHA, LTD. 发明人 TOMONARI, MASANORI;HONMA, MASATOSHI;KUNIFUSA, YOSHIYUKI
分类号 B22F9/24;B22F1/00 主分类号 B22F9/24
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