| 摘要 |
A semiconductor device (1) of the present invention has a purpose to form a structure of preventing outflow of solder at low costs. A semiconductor element (11) is bonded to a substrate (12) through a solder layer (13). An outflow-preventing part (15) is provided to surround the solder layer (13) to prevent solder outflow during soldering. The outflow-preventing part (15) is formed by a cold spray method and has a surface in an oxidized state. |
