SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve an electrical characteristic and reliability by including a penetrating electrode structure having an air gap. CONSTITUTION: A substrate(10) has a first side(11) and a second side(12) facing the first side. An integrated circuit(13) is included in the substrate. A pad(14) is electrically connected to the integrated circuit. A passivation film(15) exposing a part of the pad is formed on the first side of the substrate. An air gap(21) is formed to surround the first region of a via hole(16).