| 摘要 |
PURPOSE: A light emitting device package module is provided to being manufactured with low costs by separately constituting an electric circuit function and a heat radiation function on a wiring board and a package substrate. CONSTITUTION: A light emitting device(140) is loaded on an upper side of a package substrate(120). The package substrate emits heat generated from the light emitting device to the outside. A pair of electrode patterns(121,122) is formed on the upper side of the package substrate. A pair of wiring patterns(131,132) is formed on a lower side of a circuit board(130). A heat sink(110) is formed on the lower side of the package substrate.
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