发明名称 |
Circuit arrangement for operating light source, has unbundling board comprising conductor layer with contact pad that is coupled with contact pad of conductor layer of metal core board through solder joint |
摘要 |
<p>The circuit arrangement has insulation layer that is coupled with metal core of layer structure. The contact pads are arranged on conductor layer which faces away from metal core side. The light sources are coupled with contact pads. An unbundling board (10) is provided with insulator core (12) and conductor layers (14,16) connected to respective sides of insulator core. The contact pad (18) of conductor layer (14) of unbundling board is coupled with contact pad of conductor layer of metal core board through solder joint. An independent claim is included for method for manufacturing circuit arrangement.</p> |
申请公布号 |
DE102010043788(A1) |
申请公布日期 |
2012.05.16 |
申请号 |
DE20101043788 |
申请日期 |
2010.11.11 |
申请人 |
OSRAM AG |
发明人 |
FALLER, ALEXANDER;KAISER, MORITZ |
分类号 |
H01L25/075;H05B37/00;H05K1/18 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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