发明名称 Circuit arrangement for operating light source, has unbundling board comprising conductor layer with contact pad that is coupled with contact pad of conductor layer of metal core board through solder joint
摘要 <p>The circuit arrangement has insulation layer that is coupled with metal core of layer structure. The contact pads are arranged on conductor layer which faces away from metal core side. The light sources are coupled with contact pads. An unbundling board (10) is provided with insulator core (12) and conductor layers (14,16) connected to respective sides of insulator core. The contact pad (18) of conductor layer (14) of unbundling board is coupled with contact pad of conductor layer of metal core board through solder joint. An independent claim is included for method for manufacturing circuit arrangement.</p>
申请公布号 DE102010043788(A1) 申请公布日期 2012.05.16
申请号 DE20101043788 申请日期 2010.11.11
申请人 OSRAM AG 发明人 FALLER, ALEXANDER;KAISER, MORITZ
分类号 H01L25/075;H05B37/00;H05K1/18 主分类号 H01L25/075
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