| 摘要 |
PURPOSE: A semiconductor die bonding apparatus in which an adhesive supply part is included is provided to minimize failure rate of a die-bonding process which adheres a die to a substrate by regularly maintaining amount of adhesive dipped in an adhesive dotting pin. CONSTITUTION: An adhesive disc(10) accepts adhesive(G). A discharge port is located on one side top of the adhesive disc. The adhesive is discharged through the discharge port. An adhesive dotting pin(20) moves in order to dot the adhesive to a substrate in which a die is attached. An adhesive supply part(30) supplies the adhesive to the adhesive disc. A sweeper(40) is installed that may be ascended and descended by a sweeper ascending and descending part(41). An adhesive supply controller(50) controls amount of the adhesive provided to the adhesive disc from the adhesive supply part.
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