发明名称 |
Integrated circuit package system for shielding electromagnetic interference |
摘要 |
An integrated circuit package system includes: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element.
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申请公布号 |
US8178956(B2) |
申请公布日期 |
2012.05.15 |
申请号 |
US20070956132 |
申请日期 |
2007.12.13 |
申请人 |
DO BYUNG TAI;KUAN HEAP HOE;HUANG RUI;STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;KUAN HEAP HOE;HUANG RUI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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