| 发明名称 |
VERFAHREN ZUM TRENNEN VON MATERIALSCHICHTEN |
| 摘要 |
<p>A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.</p> |
| 申请公布号 |
AT557425(T) |
申请公布日期 |
2012.05.15 |
| 申请号 |
AT20050731585T |
申请日期 |
2005.03.29 |
| 申请人 |
JP SERCEL ASSOCIATES INC. |
发明人 |
PARK, JONGKOOK;SERCEL, JEFFREY;SERCEL, PATRICK |
| 分类号 |
H01L29/22;B23K26/40;H01L21/268;H01L21/30;H01L21/46;H01L21/78;H01L33/00 |
主分类号 |
H01L29/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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