发明名称 Semiconductor device
摘要 An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
申请公布号 US8179688(B2) 申请公布日期 2012.05.15
申请号 US20100923968 申请日期 2010.10.19
申请人 FUKUDA YUTAKA;SAITOU MITSUHIRO;NAGAYA TOSHIHIRO;KINOUCHI KAN;AKAMA SADAHIRO;NUMAZAKI KOJI;IMAIZUMI NORIHISA;DENSO CORPORATION 发明人 FUKUDA YUTAKA;SAITOU MITSUHIRO;NAGAYA TOSHIHIRO;KINOUCHI KAN;AKAMA SADAHIRO;NUMAZAKI KOJI;IMAIZUMI NORIHISA
分类号 H05K7/02;H01F7/18;H01L21/56;H01L23/36;H01L23/433;H01L23/488;H01L23/495;H01L25/04;H05K1/02;H05K1/03;H05K1/14;H05K3/28;H05K7/06;H05K7/08;H05K7/10 主分类号 H05K7/02
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