发明名称 |
Strong interconnection post geometry |
摘要 |
A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a second substrate; and joint structures disposed between the first substrate and the second substrate. Each joint structure comprises an interconnect post between the first substrate and the second substrate and a joint solder between the interconnect post and the second substrate, wherein the interconnect post exhibits a width and a first height. A pitch defines a distance between each joint structure. The first height is less than half the pitch. |
申请公布号 |
US8178970(B2) |
申请公布日期 |
2012.05.15 |
申请号 |
US20090623925 |
申请日期 |
2009.11.23 |
申请人 |
SHEN WEN-WEI;CHEN CHEN-SHIEN;KUO CHEN-CHENG;CHEN CHIH-HUA;HSIAO CHING-WEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SHEN WEN-WEI;CHEN CHEN-SHIEN;KUO CHEN-CHENG;CHEN CHIH-HUA;HSIAO CHING-WEN |
分类号 |
H01L23/488 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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