Head gimbal assembly without bus traces for plating

摘要

Head gimbal assemblies for data storage systems are provided. Some embodiments include a dielectric layer having a first and a second side. A first conductive layer is on the first dielectric layer. The first conductive layer includes a pad and a trace. A second conductive layer is on the second dielectric side. A via extends from the first dielectric layer side to the second dielectric layer side. The via electrically connects the first conductive layer to the second conductive layer.