| 摘要 |
PURPOSE: A producing method of a substrate and a processing method of the substrate are provided to reduce the separation of a film for chucking by decreasing the number of pores generated from a formation process of a chucking film. CONSTITUTION: A producing method of a substrate is for forming a protective layer(6) including a resin layer(4) and a chucking film(5) on a substrate including plural structures. The producing method of the substrate comprises the following steps: forming the resin layer on the surface of the substrate, and heating the resin layer to the temperature greater than the softening point of the resin layer; and forming the chucking film on the resin layer for forming the protective layer. |
