发明名称 Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the same
摘要 It is an object of the present invention to provide a water repellant composition for a substrate to be exposed which inhibits the back side of a substrate to be exposed from being contaminated by an immersion liquid, can improve adhesion between a film to be processed and an organic film directly overlying that film to inhibit film peeling, and has excellent workability, a method for forming a resist pattern, an electronic device produced by the formation method, a treatment method for imparting water repellency to a substrate to be exposed, a water repellent set for a substrate to be exposed, and a treatment method for imparting water repellency to a substrate to be exposed using the same. A water repellent composition for a substrate to be exposed including at least an organosilicon compound represented by the following general formula (1) and a solvent is used. In the formula, R1 is a monovalent organic group having 14 to 30 carbon atoms, each R2, R3, and R4 is independently a monovalent organic group or a hydrolyzable group having 1 to 10 carbon atoms, and at least one of R2, R3, and R4 is a hydrolyzable group.
申请公布号 US8178983(B2) 申请公布日期 2012.05.15
申请号 US20090867670 申请日期 2009.02.20
申请人 ISHIBASHI TAKEO;ISHIBASHI, LEGAL REPRESENTATIVE MIWAKO;TERAI MAMORU;HAGIWARA TAKUYA;YOKOKOJI OSAMU;TAKEBE YOKO;RENESAS ELECTRONICS CORPORATION;ASAHI GLASS COMPANY, LIMITED 发明人 ISHIBASHI TAKEO;ISHIBASHI, LEGAL REPRESENTATIVE MIWAKO;TERAI MAMORU;HAGIWARA TAKUYA;YOKOKOJI OSAMU;TAKEBE YOKO
分类号 H01L23/29;B05D3/02 主分类号 H01L23/29
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