发明名称 |
Method for production of a plurality of semiconductor chips, and a semiconductor component |
摘要 |
A method for production of a plurality of semiconductor chips (6) in a wafer composite. A semiconductor layer sequence (2) is grown on a growth substrate (1), metallization (3) is applied to the semiconductor layer sequence (2), a metal layer (4) is electrochemically deposited onto the metallization (3), and the semiconductor layer sequence (2) is then structured and separated to form individual semiconductor chips (6). The electrochemically applied metal layer (4) is particularly suitable for use as a heat spreader, for dissipation of the heat produced by the semiconductor chips (6). |
申请公布号 |
US8178372(B2) |
申请公布日期 |
2012.05.15 |
申请号 |
US20060541132 |
申请日期 |
2006.09.28 |
申请人 |
LUTGEN STEPHAN;ALBRECHT TONY;REILL WOLFGANG;OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
LUTGEN STEPHAN;ALBRECHT TONY;REILL WOLFGANG |
分类号 |
H01L21/78;H01L33/00;H01L33/64 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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