| 摘要 |
PURPOSE: A method for producing bonded substrates is provided to deposit silicon on a first substrate and bond deposited silicon on a second substrate to manufacture bonded substrates, thereby reducing the number of processes and processing costs. CONSTITUTION: A first substrate(201) is prepared. The materials of a second substrate(205) are different from the materials of the first substrate. Silicon(203) is deposited on the first substrate. The second substrate is bonded with the top of the deposited silicon.
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