| 摘要 |
PURPOSE: A method for producing bonded substrates is provided to insert first and second substrates of a simple pattern structure and bond the first and second substrates, thereby reducing the number of processes and processing costs. CONSTITUTION: A pattern structure is formed on one side of a first substrate(210) wherein the pattern structure includes a first emboss part(212a) and a first intaglio part(212b). A pattern structure is formed on the second substrate wherein the pattern structure has a second emboss part(221a) and a second intaglio part(221b). The first emboss part of the first substrate is inserted into the second intaglio part of the second substrate. The first intaglio part of the first substrate is inserted into the second emboss part of the second substrate. The first substrate is bonded with the second substrate to form a bonded substrate.
|
