| 摘要 |
PURPOSE: A method for producing bonded substrates is provided to deposit the materials of a second substrate on a first substrate and bond the second substrate onto the deposited materials to manufacture bonded substrates, thereby easily bonding two different substrates while maintaining quality. CONSTITUTION: A first substrate is prepared(S211). The materials of the second substrate are deposited on the first substrate(S212). The second substrate is bonded onto the deposited materials of the second substrate(S213). Metal or semiconductor materials are added to the materials of the second substrate.
|
