PURPOSE: A backlight unit is provided to fill a resin in a hot spot eliminating groove wherein the resin has beads, thereby drastically reducing a hot spot phenomenon. CONSTITUTION: A plurality of LED(Light Emitting Diode)s are mounted on a printed circuit board(110). A receiving groove is formed on a light guide plate(130). The receiving groove receives the LEDs. The receiving grooves is formed on one side of the light guide plate. A hot spot eliminating groove(150) is formed on the other side facing the one side.
申请公布号
KR20120047637(A)
申请公布日期
2012.05.14
申请号
KR20100109320
申请日期
2010.11.04
申请人
LG INNOTEK CO., LTD.
发明人
AHN, KYOUNG SOO;PARK, SANG JUN;JANG, JAE HYUK;KIM, JONG SUN;LEE, JEONG OH