发明名称 |
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE |
摘要 |
There is provided a wiring substrate for connecting a mounting board on one surface thereof and mounting an integrated circuit chip on the opposite surface to the surface. The wiring substrate has a conductive connecting portion penetrating the substrate for connecting to at least a portion of a wiring layer of the integrated circuit chip, with the portion of a wiring layer formed on the substrate, and an insulating portion formed at a lateral side of the connecting portion for surrounding the connecting portion via a portion of the wiring substrate. |
申请公布号 |
KR101139650(B1) |
申请公布日期 |
2012.05.14 |
申请号 |
KR20050015388 |
申请日期 |
2005.02.24 |
申请人 |
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发明人 |
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分类号 |
H01L21/60;H01L23/12;H01L23/32;H01L23/498;H01L23/52;H01L25/04;H01L25/18 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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