CMP PAD CONDITIONER AND METHOD FOR PRODUCING THE SAME

摘要

PURPOSE: A chemical mechanical polishing pad conditioner and a manufacturing method thereof are provided to maximize lifetime of the conditioner by controlling the rate of wear of a cutting tip and to expand the time in which a pad illumination is maintained. CONSTITUTION: A plurality of cutting tips is separately formed on a substrate. The plurality of cutting tips is projected from the substrate toward upper side. The upper side of the cutting tip is parallel to the substrate. The cutting tip comprises a protrusion part and a cutting part. The cutting part is extended from the protrusion part. An area of the upper side of the cutting tip is 25um^2-10000um^2. Pad illumination is maintained to 2 to 10um in the conditioning process.