发明名称 Method for Manufacturing Sputter-Coated Substrates, Magnetron Source and Sputtering Chamber with Such Source
摘要 Within a volume between a target surface and a substrate surface to be magnetron sputter coated the magnetron field pattern is formed in a circular closed loop having a radius-like extension towards a centre area of the circular closed loop. Thereby, the magnetron field arcs tunnel-like from an outer area of first magnetic pole (87 0 ) and a second inner area of second magnetic pole (87 2 '). An unbalanced long-range field pattern which is asymmetrical is generated by an increased magnetic flux along a distinct area (P), due to a sickle-like increase of the outer area (87 0 ). The magnetic field pattern is swept along the target surface by rotational movement about the axis of the circular closed loop.
申请公布号 KR101143928(B1) 申请公布日期 2012.05.11
申请号 KR20067018661 申请日期 2005.01.06
申请人 发明人
分类号 H01J37/32;H01J37/34;H01L21/203 主分类号 H01J37/32
代理机构 代理人
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