| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible substrate that facilitates visual inspection and reprocessing of solder. <P>SOLUTION: An inspection window is cut or formed at a rear end part of a flexure circuit of a head gimbal assembly (HGA), i.e. CIS of a hard disk drive, and positioning of the CIS at the head preamplifier circuit, i.e. FPC can, therefore, be visually inspected. The hole is made in a steel-made back plate and base polyimid, and arranged between adjacent conductive pads. Such a window facilitates visual inspection and enables reprocessing of solder to be performed. Further, a solder creeping-up hole may be provided to the conductive pads and/or polyimide, and the steel-made back plate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
