| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a base material film of a tape for a semiconductor manufacturing process. <P>SOLUTION: A base material film of a tape for a semiconductor manufacturing process comprises: (A) an ionomer resin obtained by crosslinking a dipolymer with metal ions, the dipolymer including ethylene and (meth)acrylic acid as polymer constituents; and (B) a substance containing a terpolymer including ethylene, (meth)acrylic acid, and (meth)acrylic acid alkyl ester as polymer constituents. In the base material film, the usage of the component (B) is within a range of 5 mass% or more and 50 mass% or less on the basis of the total amount of components (A)+(B). <P>COPYRIGHT: (C)2012,JPO&INPIT |
