| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device having a high reliability and being manufactured with ease, and to provide a method of manufacturing the light-emitting device . <P>SOLUTION: A transparent crystal substrate 2 has a light-emission surface 21 on one surface. A light-emitting element 1 is laminated on the other surface 22 opposite to the light-emission surface 21 of the transparent crystal substrate 2. An N-type semiconductor layer 31 located on the transparent crystal substrate side has a part 33 not overlapping with a P-type semiconductor layer 32. A first semiconductor surface electrode 51 of the N-type semiconductor layer 31 is provided on a surface of the non-overlapping part 33. A second semiconductor surface electrode 52 of the P-type semiconductor layer 32 is provided on a surface on the same side as the first semiconductor surface electrode 51. The light-emitting element 1 is covered with an insulating layer 6. A supporting substrate 9 is laminated on the insulating layer 6. First and second vertical conductors 71 and 72 connected to the first and second semiconductor surface electrodes 51 and 52 via the insulating layer 6, are connected to first and second penetrating electrodes 94 and 95 penetrating through the supporting substrate 9, respectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
